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Product Description
| General information | |
| Type | CPU / Microprocessor |
| Family | Intel Xeon |
| Model number ? | X5570 |
| CPU part number | AT80602000765AA (Q1G9, SLBF3) |
| Box part number | BX80602X5570 (SLBF3) |
| Frequency (MHz) ? | 2933 |
| Bus speed (MHz) ? | 3200 MHz QPI |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA8) 1.77" x 1.67" (4.5 cm x 4.25 cm) |
| Socket | Socket 1366 (LGA1366) |
| Introduction date | March 30, 2009 |
| Price at introduction | $1386 |
| Architecture / Microarchitecture | |
| Processor core | Nehalem-EP |
| Core stepping | D0 (SLBF3) |
| Manufacturing process | 0.045 micron |
| Data width | 64 bit |
| Number of cores | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 32 KB instruction caches 4 x 32 KB data caches |
| Level 2 cache size ? | 4 x 256 KB |
| Level 3 cache size | 8 MB |
| Physical memory (GB) | 144 |
| Multiprocessing | Up to 2 processors |
| Features | |
| Low power features |
|
| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| V core (V) ? | 0.75 - 1.35 |
| Minimum/Maximum operating temperature (°C) ? | 5 - 75 5 - 81 |
| Maximum power dissipation (W) ? | 197.97 155.56 (sustained) |
| Thermal Design Power (W) ? | 95 |
| Notes on Intel AT80602000765AA | |
| |
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